The modern data center is facing a physical crisis. As AI accelerators like the NVIDIA Blackwell or H100/H200 series push Thermal Design Power (TDP) to 700W and beyond, the area immediately surrounding the CPU can quickly become a major hotspot." For AI architects, this creates a catch-22: You need Gen5 NVMe storage as close to the CPU as possible for performance, but the heat in that zone causes instant thermal throttling. The solution is Storage Disaggregation—moving M.2 NV

The modern data center is facing a physical crisis. As AI accelerators like the NVIDIA Blackwell or H100/H200 series push Thermal Design Power (TDP) to 700W and beyond, the area immediately surrounding the CPU can quickly become a major hotspot." For AI architects, this creates a catch-22: You need Gen5 NVMe storage as close to the CPU as possible for performance, but the heat in that zone causes instant thermal throttling. The solution is Storage Disaggregation—moving M.2 NV

For years, Edge AI was forced into a corner: you either used underpowered integrated chips or massive, power-hungry GPUs that wouldn't fit in a ruggedized industrial-grade enclosure. Today, Edge architecture is shifting. The rise of M.2 AI Processing Units (AIPUs)—like the Hailo-10, Axelera Metis, and Ambrize—has introduced the era of Modular Compute. But these modules are only as good as the interface they plug into. To build a true "Swiss Army Knife" for your Edge environme